FEATURES

• Recommended by AMD for Opteron
• Copper-Aluminum heat sink for high thermal conductivity
• Stamped fin technology provides high density fin array
• Powerful speed control 2 ball-bearing fan for noise reduction
• Type II easy clip method (Type I screw-down available upon request)
• Shin Etsu G751 thermal interface material pre-applied
• Retention frame and backing plate assembly also available

Download printable version (PDF: 100k)

For installation instructions and other frequently asked questions, please visit our Support section.