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AJ11223

Ajigo Heat Sink for AMD Opteron 1U

Features
  • Copper heat sink for high thermal conductivity
  • Stamped fin technology provides high density fin array
  • Spring Screws provides optimal pressure
  • Shin Etsu G751 thermal interface material pre-applied
  • 2mm Back Plate with Insulator also included
Dimensions

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Specifications

Heat Sink: Cu Anti-oxidized
Back Plate: 2mm w/ Insulator
Thermal Interface: G-751XXX
Overall Weight: 570 gm

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