Ajigo Corporation | AJ00323

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AJ00323

Ajigo Heat Sink for Intel Nocona 1U

Features
Dimensions
Specifications

Features

Copper heat sink for high thermal conductivity
Stamped fin technology provides high density fin array
Spring screw attachment provides optimal pressure
Shin Etsu G751 thermal interface material pre-applied
Custom back plate with insulator also included

Dimensions

Specifications

Heat Sink: Cu

Back Plate: custom

Thermal Interface: G-751

Overall Height: 24.4 mm