Ajigo Corporation | AJ00212

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AJ00212

Ajigo Heat Sink for Intel Xeon 1U

Features
Dimensions
Specifications

Features

Copper heat sink for high thermal conductivity
Stamped fin technology provides high density fin array
Side clip attachment provides optimal pressure
Shin Etsu G751 thermal interface material pre-applied
Retention frame also included

Dimensions

Specifications

Heat Sink: Cu Anti-oxidized

Retention Frame: 423 pin

Thermal Interface: G-751

Overall Weight: 500 gm