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AJ00209
Ajigo Heat Sink for AMD Opteron 1U
Features
Dimensions
Specifications
Features
Copper-Aluminum heat sink for high thermal conductivity
Stamped fin technology provides high density fin array
Spring screws provides optimal pressure
Shin Etsu G751 thermal interface material pre-applied
2mm Back Plate with Insulator also included
Dimensions
Top
Specifications
Heat Sink:
Ni plated Cu-Al
Back Plate:
2mm w/ Insulator
Thermal Interface:
G-751
Overall Weight:
430 gm
Top
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