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AJ00170
Ajigo Heat Sink for AMD Opteron 1U
Features
Dimensions
Specifications
Features
Copper-Aluminum heat sink for high thermal conductivity
Stamped fin technology provides high density fin array
Type I clip provides optimal pressure
Shin Etsu G751 thermal interface material pre-applied
Retention frame also included
Printable version
(PDF, 184k)
Dimensions
Top
Specifications
Heat Sink:
Ni plated Cu-Al
Retention Frame:
Lexan 3412R
Thermal Interface:
G-751
Overall Weight:
289 gm
Top
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